Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11139584
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Filing Dt:
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05/31/2005
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Publication #:
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Pub Dt:
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12/01/2005
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Inventor:
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Hiroyuki Shoji
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Title:
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Interposer substrate, semiconductor package and semiconductor device, and their producing methods
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753, SHIMONUMABE |
| NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, JAPAN |
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| YOUNG & THOMPSON |
| 745 SOUTH 23RD STREET |
| 2ND FLOOR |
| ARLINGTON, VA 22202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI |
| KANAGAWA 211-8668, JAPAN |
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| YOUNG & THOMPSON |
| 745 SOUTH 23RD STREET |
| 2ND FLOOR |
| ARLINGTON, VA 22202 |
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