Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11007857
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Filing Dt:
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12/09/2004
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Publication #:
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Pub Dt:
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12/15/2005
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Inventors:
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Zhi-Wen Sun, Renren He
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Title:
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Method of barrier layer surface treatment to enable direct copper plating on barrier metal
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 450-A |
| PATENT COUNSEL |
| SANTA CLARA, CALIFORNIA 95052 |
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| APPLIED MATERIALS, INC. |
| PATENT COUNSEL |
| P.O. BOX 450-A |
| SANTA CLARA, CA 95052 |
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