Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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03/18/2008
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Application #:
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11205182
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Filing Dt:
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08/17/2005
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Publication #:
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Pub Dt:
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12/15/2005
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Inventors:
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Hien Boon Tan, Anthony Yi Sheng Sun
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Title:
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HIGH DENSITY CHIP SCALE LEADFRAME PACKAGE AND METHOD OF MANUFACTURING THE PACKAGE
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Assignment:
1
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| 1111 FANNIN STREET |
| 10TH FLOOR |
| HOUSTON, TEXAS 77002 |
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| MARCELA ROBLEDO |
| 2550 HANOVER STREET |
| PALO ALTO, CA 94304 |
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Assignment:
2
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| 1111 FANNIN STREET |
| 10TH FLOOR |
| HOUSTON, TEXAS 77002 |
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| MARCELA ROBLEDO |
| 2550 HANOVER ST. |
| PALO ALTO, CA 94304 |
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Assignment:
3
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 5 SERANGOON NORTH AVENUE 5 |
| ANG MO KIO DISTRICT, SINGAPORE 554916 |
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| SUSAN ZABLOCKI |
| KIRKLAND & ELLIS LLP |
| 601 LEXINGTON AVENUE |
| NEW YORK, NY 10022 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 22 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569506 |
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| HORIZON IP PTE. LTD. |
| 7500A BEACH ROAD, #04-306/308 |
| THE PLAZA |
| SINGAPORE, 199591 SINGAPORE |
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