Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10854131
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Filing Dt:
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05/26/2004
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Publication #:
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Pub Dt:
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12/15/2005
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Inventor:
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Chih-Ming Chung
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Title:
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Multi-chip module package structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD. RD., 811 |
| NANTZE EXPORT |
| PROCESSING ZONE, KAOHSIUNG, TAIWAN R.O.C. |
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| J. C. PATENTS |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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