Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/22/2008
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Application #:
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10975047
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Filing Dt:
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10/28/2004
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Publication #:
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Pub Dt:
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12/15/2005
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Inventors:
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Koji Nozaki, Takahisa Namiki, Miwa Kozawa
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Title:
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RESIST PATTERN THICKENING MATERIAL AND PROCESS FOR FORMING THE SAME, AND SEMICONDUCTOR DEVICE AND PROCESS FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA 211-8558, JAPAN |
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| WESTERMAN, HATTORI, DANIELS |
| & ADRIAN, LLP |
| 1250 CONNECTICUT AVENUE, NW |
| SUITE 700 |
| WASHINGTON, DC 20036 |
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