Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/08/2009
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Application #:
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11107529
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Filing Dt:
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04/15/2005
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Publication #:
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Pub Dt:
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12/15/2005
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Inventors:
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Jung-Hwan Kim, Hun-Hyeoung Leam, Jai-Dong Lee, Young-Seok Kim, Young-Sub You, Ki-Su Na et al
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Title:
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METHODS OF FORMING VOID-FREE LAYERS IN OPENINGS OF SEMICONDUCTOR SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MITCHELL S. BIGEL |
| MYERS BIGEL SIBLEY, ET AL. |
| P.O. BOX 37428 |
| RALEIGH, NC 27627 |
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