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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/10/2010
Application #:
11155389
Filing Dt:
06/16/2005
Publication #:
Pub Dt:
12/22/2005
Inventor:
Hiroyuki Nakagawa
Title:
RINSING COMPOSITION, AND METHOD FOR RINSING AND MANUFACTURING SILICON WAFER
Assignment: 1
Reel/Frame:
017114/0900Recorded: 12/13/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/07/2005
Assignee:
1-1, CHIRYO 2-CHOME, NISHIBIWAJIMA-CHO
KIYOSU-SHI
AICHI 452-8502, JAPAN
Correspondent:
SCOTT Q. VIDAS
VIDAS, ARRETT & STEINKRAUS, P.A.
SUITE 2000
6109 BLUE CIRCLE DRIVE
MINNETONKA, MN 55343-9131

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