Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/24/2007
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Application #:
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10524013
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Filing Dt:
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02/08/2005
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Publication #:
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Pub Dt:
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01/05/2006
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Inventors:
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Hisashi Yamada, Noboru Fukuhara
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Title:
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METHOD FOR PRODUCING COMPOUND SEMICONDUCTOR WAFER AND COMPOUND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 27-1, SHINKAWA 2-CHOME, CHUO-KU |
| TOKYO, JAPAN |
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| 27-1, SHINKAWA 2-CHOME, CHUO-KU |
| TOKYO, JAPAN |
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| JOHN W. BAILEY |
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE RD |
| SUITE 100 EAST, P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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