Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11143206
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Filing Dt:
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06/02/2005
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Publication #:
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Pub Dt:
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01/05/2006
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Inventors:
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Albert Auburger, Stefan Paulus, Adolf Koller
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Title:
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Semiconductor module with a semiconductor sensor chip and a plastic package as well as method for its production
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST.-MARTIN-STRASSE 53 |
| MUNCHEN, GERMANY 81669 |
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| THOMAS G. ESCHWEILER |
| ESCHWEILER & ASSOCIATES, LLC |
| 629 EUCLID AVENUE |
| SUTIE 1210 |
| CLEVELAND, OH 44114 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768923 |
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| KATHY MANKE |
| 4380 ZIEGLER ROAD |
| FORT COLLINS, CO 80525 |
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