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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/12/2008
Application #:
10533147
Filing Dt:
04/27/2005
Publication #:
Pub Dt:
01/12/2006
Inventors:
Susumu Maeda, Hiroshi Inagaki, Shigeki Kawashima, Shoei Kurosaka, Kozo Nakamura
Title:
METHOD FOR PRODUCING SILICON WAFER
Assignment: 1
Reel/Frame:
016981/0410Recorded: 04/27/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/15/2005
Exec Dt:
04/15/2005
Exec Dt:
04/15/2005
Exec Dt:
04/15/2005
Exec Dt:
04/15/2005
Assignee:
25-1, SHINOMIYA 3-CHOME
HIRATSUKA-SHI, KANAGAWA, JAPAN 254-0014
Correspondent:
GERALD T. SHEKLETON
WELSH & KATZ, LTD.
120 SOUTH RIVERSIDE PLAZA, 22ND FLOOD
CHICAGO, IL 60606
Assignment: 2
Reel/Frame:
020733/0381Recorded: 04/01/2008Pages: 13
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/01/2007
Assignee:
1324-2, MASURAGAHARA-MACHI
OMURA-SHI
NAGASAKI, JAPAN 856-8555
Correspondent:
GERALD T. SHEKLETON
120 S. RIVERSIDE PLAZA, 22ND FLOOR
CHICAGO, IL 60606

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