Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11156586
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Filing Dt:
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06/21/2005
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Publication #:
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Pub Dt:
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01/12/2006
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Inventors:
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Hideo Imai, Kazuaki Sakurada
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Title:
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Wiring board, method of manufacturing wiring board, and electronic device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1 NISHISHINJUKU 2-CHOME |
| SHINJUKU-KU, TOKYO, JAPAN 163-0811 |
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| SHINJYU GLOBAL IP COUNSELORS, LLP |
| KIYOE K. KABASHIMA |
| 1233 TWENTIETH STREET, NW |
| SUITE 700 |
| WASHINGTON, D.C. 20036 |
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