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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/14/2006
Application #:
10896975
Filing Dt:
07/23/2004
Publication #:
Pub Dt:
01/26/2006
Inventors:
Hsiao-Lin Kuo, Ching-Chien Chen, Kwo-Fang Ku, Yu-Chin Hsu
Title:
INSULATED STRUCTURE OF A CHIP ARRAY COMPONENT AND FABRICATION METHOD OF THE SAME
Assignment: 1
Reel/Frame:
015624/0136Recorded: 07/23/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/15/2004
Exec Dt:
06/15/2004
Exec Dt:
06/15/2004
Exec Dt:
06/15/2004
Assignee:
2F, NO. 38, INDUSTRY EASTERN 4TH RD.
SCIENCE-BASED INDUSTRIAL PARK
HSINCHU, TAIWAN R.O.C.
Correspondent:
DENNISON, SCHULTZ, DOUGHERTY & MACDONALD
DAVID E. DOUGHERTY
1727 KING STREET, SUITE 105
ALEXANDRIA, VIRGINIA 22314

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