Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/28/2007
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Application #:
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10903796
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Filing Dt:
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07/29/2004
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Publication #:
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Pub Dt:
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02/02/2006
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Inventor:
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Charles M. Watkins
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Title:
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INTEGRATED CIRCUIT AND METHODS OF REDISTRIBUTING BONDPAD LOCATIONS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83716 |
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| WELLS ST. JOHN P.S. |
| MARK S. MATKIN |
| 601 WEST FIRST AVENUE |
| SUITE 1300 |
| SPOKANE, WA 99201-3828 |
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