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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11189745
Filing Dt:
07/27/2005
Publication #:
Pub Dt:
02/02/2006
Inventors:
Kazuki Uwada, Yuji Hotta, Naoki Sadayori
Title:
Resin for optical-semiconductor element encapsulation
Assignment: 1
Reel/Frame:
016822/0417Recorded: 07/27/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/08/2005
Exec Dt:
07/08/2005
Exec Dt:
07/08/2005
Assignee:
1-2 SHIMOHOZUMI 1-CHOME
IBARAKI-SHI, OSAKA, JAPAN
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037

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