Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11237918
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Filing Dt:
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09/29/2005
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Publication #:
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Pub Dt:
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02/02/2006
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Inventors:
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Koichi Izumida, Yuki Takano, Hitoshi Abe, Toshiyuki Moribayashi, Koichi Hagio et al
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Title:
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Lead-free solder alloy and electronic component using this lead-free solder alloy
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Assignment:
1
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 3-6, NIHONBASHI NINGYO-CHO, 3-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-8589 |
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| RICHARD V. BURGUJIAN |
| 901 NEW YORK AVENUE, N.W. |
| FINNEGAN HENDERSON FARABOW GARRETT & DUN |
| WASHINGTON, DC 20001-4413 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6, NIHONBASHI NINGYO-CHO, 3-CHOME, CHUO-KU |
| TOKYO, JAPAN 103-8589 |
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| RICHARD V. BURGUJIAN |
| 901 NEW YORK AVENUE, N.W. |
| FINNEGAN HENDERSON FARABOW GARRETT & DUN |
| WASHINGTON, DC 20001-4413 |
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