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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
10903365
Filing Dt:
07/30/2004
Publication #:
20060024943
Pub Dt:
02/02/2006
Inventors:
Sung Kwon Kang, Da-Yuan Shih, Yoon-Chul Son
Title:
Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
Assignment: 1
Reel/Frame:
015734/0061Recorded: 07/30/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KANG, SUNG KWON
Exec Dt:
07/07/2004
SHIH, DA-YUAN
Exec Dt:
07/02/2004
SON, YOON-CHUL
Exec Dt:
07/09/2004
Assignee:
IBM CORPORATION
ARMONK, NEW YORK 10504
Correspondent:
ALVIN J. RIDDLES
BOX 34, CANDLEWOOD ISLE
NEW FAIRFIELD, CT 06812
Assignment: 2
Reel/Frame:
036550/0001Recorded: 09/03/2015Pages: 983
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INTERNATIONAL BUSINESS MACHINES CORPORATION
Exec Dt:
06/29/2015
Assignee:
GLOBALFOUNDRIES U.S. 2 LLC
2070 ROUTE 52
HOPEWELL JUNCTION, NEW YORK 12533
Correspondent:
HESLIN ROTHENBERG FARLEY & MESITI P.C.
5 COLUMBIA CIRCLE
ALBANY, NY 12203
Assignment: 3
Reel/Frame:
036779/0001Recorded: 10/05/2015Pages: 985
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GLOBALFOUNDRIES U.S. 2 LLC
Exec Dt:
09/10/2015
GLOBALFOUNDRIES U.S. INC.
Exec Dt:
09/10/2015
Assignee:
GLOBALFOUNDRIES INC.
PO BOX 309
UGLAND HOUSE
GRAND CAYMAN, CAYMAN ISLANDS KY1-1104
Correspondent:
HESLIN ROTHENBERG FARLEY & MESITI P.C.
5 COLUMBIA CIRCLE
ALBANY, NY 12203

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