Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11194916
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Filing Dt:
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08/01/2005
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Publication #:
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Pub Dt:
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02/09/2006
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Inventor:
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Jeong Cho
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Title:
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Laminate for flexible printed circuit board comprising tie layer of ternary copper alloy
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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93-1, IMSU-DONG KYUNGSANGBUK-DO |
GUMI, KOREA, REPUBLIC OF |
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PHOUPHANOMKETH DITTHAVONG |
DITTHAVONG & CARLSON, P.C. |
10507 BRADDOCK ROAD, SUITE A |
FAIRFAX, VIRGINIA 22032 |
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