Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10912602
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Filing Dt:
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08/04/2004
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Publication #:
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Pub Dt:
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02/09/2006
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Inventor:
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Chien-Wei Chang
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Title:
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Packaging method for manufacturing substrates
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1245, JUNGHUA RD. |
| SHIN-WU SHIANG |
| TAOYUAN, TAIWAN |
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| SUPREME PATENT SERVICES |
| JASON Z. LIN |
| POST OFFICE BOX 2339 |
| SARATOGA, CA 95070 |
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