Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/13/2007
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Application #:
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10915139
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Filing Dt:
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08/09/2004
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Publication #:
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Pub Dt:
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02/09/2006
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Inventors:
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Peijun Ding, Fuhong Zhang, Hsien-Lung Yang, Michael A. Miller, Jianming Fu, Jick M. Yu et al
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Title:
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SPUTTER DEPOSITION AND ETCHING OF METALLIZATION SEED LAYER FOR OVERHANG AND SIDEWALL IMPROVEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P. O. BOX 450A |
| PATENT/LEGAL DEPT - M/S 2061 |
| SANTA CLARA, CALIFORNIA 95052 |
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| APPLIED MATERIALS, INC. |
| ROBERT W. MULCAHY |
| PATENT/LEGAL DEPARTMENT - M/S 2061 |
| P.O. BOX 450A |
| SANTA CLARA, CA 95052 |
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