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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10539957
Filing Dt:
06/17/2005
Publication #:
Pub Dt:
02/16/2006
Inventors:
Martin Weber, Bernd Bruchmann, Hideko Oyama, Takashi Inoue, Toshiaki Ougizawa et al
Title:
Thermoplastic molding compositions
Assignment: 1
Reel/Frame:
017423/0574Recorded: 06/19/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/24/2003
Exec Dt:
06/10/2003
Assignee:
GROENEWOUDSEWEG 1
EINDHOVEN, NETHERLANDS 5621 BA
Correspondent:
PHILIPS ELECTRONICS NORTH AMERICA CORP.
P.O. BOX 3001
BRIARCLIFF MANOR, NY 10510-8001
Assignment: 2
Reel/Frame:
016555/0600Recorded: 07/22/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/07/2004
Exec Dt:
01/07/2004
Exec Dt:
01/14/2004
Exec Dt:
01/15/2004
Exec Dt:
01/19/2004
Exec Dt:
01/10/2004
Assignee:
LUDWIGSHAFEN, GERMANY D-67056
Correspondent:
ASHLEY I. PEZZNER
CONNOLLY BOVE LODGE & HUTZ LLP
1007 NORTH ORANGE STREET
P.O. BOX 2207
WILMINGTON, DE 19899

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