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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/30/2014
Application #:
10536621
Filing Dt:
05/26/2005
Publication #:
Pub Dt:
02/23/2006
Inventors:
Masahiko Nakamori, Tetsuo Shimomura, Takatoshi Yamada, Atsushi Kazuno et al
Title:
Polishing pad and method of producing semiconductor device
Assignment: 1
Reel/Frame:
017111/0902Recorded: 05/26/2005Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/20/2005
Exec Dt:
05/20/2005
Exec Dt:
05/20/2005
Exec Dt:
05/20/2005
Exec Dt:
05/20/2005
Exec Dt:
05/20/2005
Assignee:
17-18, EDOBORI 1-CHOME, NISHI-KU
OSAKA-SHI, OSAKA 550-8661, JAPAN
Correspondent:
KNOBBE, MARTENS, OLSON & BEAR, LLP
2040 MAIN STREET, 14TH FLOOR
IRVINE, CA 92614
Assignment: 2
Reel/Frame:
037996/0954Recorded: 03/16/2016Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/25/2015
Assignee:
451 BELLEVUE ROAD
NEWARK, DELAWARE 19713
Correspondent:
KATHY WERTZ
2040 DOW CENTER
MIDLAND, MI 48674

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