Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11170061
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Filing Dt:
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06/30/2005
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Publication #:
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Pub Dt:
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02/23/2006
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Inventors:
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Seong-Kyu Yun, Kenichi Orui, Chang-Ki Hong, Jae-Dong Lee, Sung-Jun Kim, Haruki Nojo
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Title:
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Slurry, chemical mechanical polishing method using the slurry, and method of forming a surface of a capacitor using the slurry
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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416 MAETAN-DONG, YEONGTONG-GU |
SUWON-SI |
GYEONGGI-DI, KOREA, REPUBLIC OF |
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HARNESS, DICKEY & PIERCE, P.L.C. |
P.O. BOX 8910 |
RESTON, VA 20195 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY NAME, PREVIOUSLY RECORDED AT REEL 016892, FRAME 0894.
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416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI |
GYEONGGI-DI, KOREA, REPUBLIC OF |
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HARNESS, DICKEY & PIERCE, P.L.C. |
P.O. BOX 8910 |
RESTON, VA 20195 |
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