Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11206599
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Filing Dt:
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08/18/2005
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Publication #:
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Pub Dt:
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03/02/2006
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Inventors:
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Markus Blietz, Robert Hoelzl, Reinhold Wahlich, Andreas Huber
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Title:
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Layered semiconductor wafer with low warp and bow, and process for producing it
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HANNS-SEIDEL-PLATZ 4 |
| MUNCHEN, GERMANY D-81737 |
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| WILLIAM G. CONGER |
| BROOKS KUSHMAN P.C. |
| 1000 TOWN CENTER, TWENTY-SECOND FLOOR |
| SOUTHFIELD, MICHIGAN 48075-1238 |
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