Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11078710
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Filing Dt:
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03/14/2005
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Publication #:
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Pub Dt:
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03/16/2006
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Inventors:
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Takeo Nakagawa, Hisao Yamazaki, Hideo Yoshimura, Masanori Kunieda, Akira Sato et al
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Title:
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Layered metal mold and method of using the same for molding
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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3-8-1, HARUMI-CHO, FUCHU-CITY |
TOKYO, 183-0057, JAPAN |
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34-21, KOINAKA 3-CHOME, NISHI-KU |
HIROSHIMA-CITY, HIROSHIMA, 733-0813, JAPAN |
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4-1-55, HIEDA-CHO |
TAKAHAMA-CITY, AICHI, 444-1321, JAPAN |
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BARRY E. BRETSCHNEIDER |
MORRISON & FOERSTER LLP |
1650 TYSONS BLVD., SUITE 300 |
MCLEAN, VA 22102 |
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