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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11207562
Filing Dt:
08/19/2005
Publication #:
Pub Dt:
03/16/2006
Inventors:
Mitsumasa Koyanagi, Hiroyuki Kurino, Jeoung Chill Shim
Title:
Method of forming nickel-silicon compound, semiconductor device, and semiconductor device manufacturing method
Assignment: 1
Reel/Frame:
016834/0130Recorded: 11/30/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/02/2005
Exec Dt:
11/01/2005
Exec Dt:
10/31/2005
Assignee:
17-2, SHIN-YOKOHAMA 3-CHOME
KOHOKU-KU
YOKOHAMA-SHI, KANAGAWA, JAPAN 222-0033
Correspondent:
JEFFREY M. SAKOI
1420 FIFTH AVENUE, SUITE 2800
SEATTLE, WA 98101-2347

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