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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
05/23/2006
Application #:
10948510
Filing Dt:
09/22/2004
Publication #:
Pub Dt:
03/23/2006
Inventors:
John Boyd, Fred C. Redeker, Yezdi Dordi
Title:
SEMICONDUCTOR WAFER MATERIAL REMOVAL APPARATUS AND METHOD FOR OPERATING THE SAME
Assignment: 1
Reel/Frame:
015831/0184Recorded: 09/22/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/22/2004
Exec Dt:
09/22/2004
Exec Dt:
09/22/2004
Assignee:
4650 CUSHING PARKWAY
FREMONT, CALIFORNIA 94538
Correspondent:
MARTINE PENILLA & GENCARELLA, LLP
710 LAKEWAY DRIVE
SUITE 200
SUNNYVALE, CA 94085
Assignment: 2
Reel/Frame:
020951/0935Recorded: 05/18/2008Pages: 44
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/08/2008
Assignee:
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054-3299
Correspondent:
PATTERSON & SHERIDAN, L.L.P.
3040 POST OAK BLVD., SUITE 1500
HOUSTON, TX 77056-6582

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