Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11233672
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Filing Dt:
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09/23/2005
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Publication #:
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Pub Dt:
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03/30/2006
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Inventors:
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Jeong-Sik Lee, Tomoya Sugahara
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Title:
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Wafer for compound semiconductor devices
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6-3, KITANO, NIIZA-SHI |
| SAITAMA, JAPAN |
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| MICHAEL P. DUNNAM |
| WOODCOCK WASHBURN LLP |
| ONE LIBERTY PLACE-46TH FLOOR |
| PHILADELPHIA, PA 19103-7301 |
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Assignment:
2
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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| 100 INNOVATIVE WAY |
| NASHUA, NEW HAMPSHIRE 03062 |
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| JEFF KLUGMAN |
| 345 CALIFORNIA STREET |
| SUITE 2200 |
| SAN FRANCISCO, CA 94104 |
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