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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/15/2007
Application #:
10950691
Filing Dt:
09/28/2004
Publication #:
Pub Dt:
04/06/2006
Inventors:
Song-Hua Shi, Tian-An Chen, Jason Zhang, Katrina Certeza
Title:
UNDERFILL MATERIAL TO REDUCE BALL LIMITING METALLURGY DELAMINATION AND CRACKING POTENTIAL IN SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
016154/0236Recorded: 01/13/2005Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/29/2004
Exec Dt:
11/29/2004
Exec Dt:
12/13/2004
Exec Dt:
11/29/2004
Assignee:
2200 MISSION COLLEGE BLVD.
MAILSTOP SC4-202
SANTA CLARA, CALIFORNIA 95052-8119
Correspondent:
EITAN, PEARL, LATZER & COHEN ZEDEK, LLP
CALEB POLLACK
10 ROCKEFELLER PLAZA
SUITE 1001
NEW YORK, NEW YORK 10020

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