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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11253490
Filing Dt:
10/19/2005
Publication #:
Pub Dt:
04/13/2006
Inventors:
Sergey Savastiouk, Sam Kao
Title:
Attachment of integrated circuit structures and other substrates to substrates with vias
Assignment: 1
Reel/Frame:
027873/0022Recorded: 03/15/2012Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/20/2011
Assignee:
2702 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondent:
HAYNES AND BOONE, LLP - IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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