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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10966537
Filing Dt:
10/15/2004
Publication #:
Pub Dt:
04/20/2006
Inventors:
Shyi-Ming Pan, Fen-Ren Chien
Title:
Light emitting semiconductor bonding structure and method of manufacturing the same
Assignment: 1
Reel/Frame:
015904/0208Recorded: 10/15/2004Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/20/2004
Exec Dt:
09/20/2004
Assignee:
NO.99, LUN-YUAN 1ST RD.
LUN-TAN
TAOYUAN, TAIWAN
Correspondent:
SUPREME PATENT SERVICES
JASON Z. LIN
POST OFFICE BOX 2339
SARATOGA, CA 95070
Assignment: 2
Reel/Frame:
040149/0765Recorded: 09/26/2016Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/22/2016
Assignee:
5 LI HSIN 5TH RD., SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, P.C.
4000 LEGATO RD., SUITE 310
FAIRFAX, VA 22033

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