Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11163134
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Filing Dt:
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10/06/2005
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Publication #:
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Pub Dt:
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04/20/2006
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Inventors:
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Chien Liu, Meng-Jen Wang, Sheng-Tai Tsai
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Title:
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Wafer Level Process for Manufacturing Leadframes and Device from the Same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
| KAO-HSIUNG CITY, TAIWAN |
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| NORTH AMERICA INTELLECTUAL PROPERTY CORP |
| P.O. BOX 506 |
| MERRIFIELD, VA 22116 |
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