Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/15/2009
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Application #:
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10540927
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Filing Dt:
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06/29/2005
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Publication #:
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Pub Dt:
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04/20/2006
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Inventors:
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Akihiro Yoshino, Kumeo Kondo, Koji Tomoda
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Title:
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BONDING AID FOR POLYAMIDE RESIN AND METHOD OF BONDING WITH THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 126-1, HAYASHI-SHINDEN, YOKONE-CHO, OBU-SHI |
| AICHI 474-0011, JAPAN |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| ATTN: MICHAEL R. DAVIS, ESQ. |
| 1030 15TH STREET, N.W., SUITE 400 EAST |
| WASHINGTON, DC 20005-1503 |
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