Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/29/2006
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Application #:
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11136181
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Filing Dt:
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05/24/2005
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Publication #:
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Pub Dt:
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04/27/2006
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Inventors:
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Ming-Lun Ho, Chih-Ming Chung
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Title:
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METHOD FOR FLIP CHIP BONDING BY UTILIZING AN INTERPOSER WITH EMBEDDED BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26 CHIN 3RD ROAD |
| NANTZE EXPORT PROCESSING ZONE KAOHSIUNG |
| KAOHSIUNG, TAIWAN R.O.C. |
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| WILLIAM R. EVANS |
| LADAS & PARRY |
| 26 WEST 61 STREET |
| NEW YORK, NY 10023 |
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