Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11259128
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Filing Dt:
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10/27/2005
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Publication #:
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Pub Dt:
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05/04/2006
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Inventors:
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Mitsushi Itano, Takehiko Kezuka, Takashi Kanemura
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Title:
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Solution and method for removing ashing residue in Cu/low-k multilevel interconnection structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| UMEDA CENTER BUILDING, 4-12 |
| NAKAZAKI-NISHI 2-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA-FU, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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