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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/31/2007
Application #:
11076927
Filing Dt:
03/11/2005
Publication #:
Pub Dt:
05/04/2006
Inventor:
Meng-Jen Wang
Title:
MULTI-PACKAGE MODULE WITH HEAT SPREADER
Assignment: 1
Reel/Frame:
016375/0569Recorded: 03/11/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/02/2005
Assignee:
NO. 26, CHIN 3RD RD., NANTZE EXPORT
PROCESSING ZONE, KAOHSIUNG, TAIWAN R.O.C.
Correspondent:
TROXELL LAW OFFICE PLLC
5205 LEESBURG PIKE, SUITE 1404
FALLS CHURCH, VIRGINIA 22041-3401

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