Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10978008
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Filing Dt:
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10/29/2004
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Publication #:
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Pub Dt:
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05/04/2006
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Inventor:
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Hsin-Hui Lee
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Title:
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Flip chip BGA process and package with stiffener ring
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD 6 |
SCIENCE BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN 300-77 R.O.C. |
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WILLIAM H. MURRAY, ESQUIRE |
DUANE MORRIS LLP |
ONE LIBERTY PLACE |
PHILADELPHIA, PA 19103 |
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