Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/05/2008
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Application #:
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11268356
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Filing Dt:
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11/07/2005
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Publication #:
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Pub Dt:
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05/11/2006
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Inventors:
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Theresia Bauer, Robert Hoelzl, Andreas Huber, Reinhold Wahlich
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Title:
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METHOD AND APPARATUS FOR LEVELING A SEMICONDUCTOR WAFER, AND SEMICONDUCTOR WAFER WITH IMPROVED FLATNESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HANNS-SEIDEL-PLATZ 4 |
| MUNICH, GERMANY 81737 |
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| WILLIAM G. CONGER |
| BROOKS KUSHMAN P.C. |
| 1000 TOWN CENTER |
| TWENTY-SECOND FLOOR |
| SOUTHFIELD, MI 48075-1238 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE RECEIVING PARTY. DOCUMENT PREVIOUSLY RECORDED AT REEL 017208 FRAME 0643.
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| HANNS-SEIDEL-PLATZ 4 |
| MUNICH, GERMANY 81737 |
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| WILLIAM G. CONGER |
| BROOKS KUSHMAN PC |
| 1000 TOWN CENTER |
| 22ND FLOOR |
| SOUTHFIELD, MI 48075-1238 |
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