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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/24/2007
Application #:
10985444
Filing Dt:
11/10/2004
Publication #:
Pub Dt:
05/11/2006
Inventors:
Jer-Shen Maa, Jong-Jan Lee, Douglas J. Tweet, Sheng Teng Hsu
Title:
FABRICATION OF A LOW DEFECT GERMANIUM FILM BY DIRECT WAFER BONDING
Assignment: 1
Reel/Frame:
015992/0170Recorded: 11/10/2004Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/10/2004
Exec Dt:
11/10/2004
Exec Dt:
11/10/2004
Exec Dt:
11/10/2004
Assignee:
5750 NW PACIFIC RIM BLVD.
CAMAS, WASHINGTON 98607
Correspondent:
SHARP LABORATORIES OF AMERICA, INC.
DAVID C. RIPMA
5750 NW PACIFIC RIM BLVD.
CAMAS, WA 98607
Assignment: 2
Reel/Frame:
019795/0658Recorded: 09/10/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/10/2007
Assignee:
22-22, NAGAIKE-CHO, ABENO-KU
OSAKA, JAPAN 545-8522
Correspondent:
THERESA BELLAND
5750 NW PACIFIC RIM BLVD
CAMAS, WA 98607

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