Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
08/26/2008
|
Application #:
|
11066483
|
Filing Dt:
|
02/28/2005
|
|
Publication #:
|
|
Pub Dt:
|
05/11/2006
| | | | |
|
Inventors:
|
Norio Kainuma, Hidehiko Kira, Kenji Kobae, Kimio Nakamura, Takayoshi Matsumura
|
|
Title:
|
METHOD FOR FLIP-CHIP MOUNTING UTILIZING A DELAY CURING-TYPE ADHESIVE WITH TWO-PART HARDENING RESIN
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN |
|
|
|
|
| ARENT FOX PLLC |
| 1050 CONNECTICUT AVENUE, NW |
| SUITE 400 |
| WASHINGTON, DC 20036-5339 |
|
|
Search Results as of:
04/29/2024 06:56 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
