Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/09/2008
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Application #:
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10547887
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Filing Dt:
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10/31/2005
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Publication #:
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Pub Dt:
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05/11/2006
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Inventors:
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Hideki Matsumoto, Daisuke Sato, Akiko Tanaka, Toru Yamanaka
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Title:
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THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE, AND FILM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NIHONBASHI-MUROMACHI 2-CHOME |
| CHUO-KU, TOKYO 103-8666, JAPAN |
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| IP GROUP OF DLA PIPER RUDNICK GRAY |
| CARY US LLP |
| ONE LIBERTY PLACE, SUITE 4900 |
| 1650 MARKET STREET |
| PHILADELPHIA, PENNSYLVANIA 19103 |
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