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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	7314777	Issue Dt:	01/01/2008	Application #:	10988799	Filing Dt:	11/15/2004
Publication #:	20060105499	Pub Dt:	05/18/2006
Inventors:	Jon B. DCamp, Harlan L. Curtis, Lori A. Dunaway, Max C. Glenn
Title:	CHIP PACKAGING SYSTEMS AND METHODS

Assignment: 1

Reel/Frame:

015456/0672

Recorded: 12/15/2004

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

DCAMP, JON B.

Exec Dt:

11/15/2004

CURTIS, HARLAN L.

Exec Dt:

11/15/2004

DUNAWAY, LORI A.

Exec Dt:

11/15/2004

GLENN, MAX C.

Exec Dt:

11/15/2004

Assignee:

HONEYWELL INTERNATIONAL INC.

101 COLUMBIA ROAD

MORRISTOWN, MINNESOTA 55403

Correspondent:

CROMPTON, SEAGER & TUFTE

1221 NICOLLET AVENUE

STE. 800

MINNEAPOLIS, MN 55403

Assignment: 2

Reel/Frame:

015468/0750

Recorded: 12/17/2004

Pages: 9

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE STATE AND ZIP CODE OF THE ASSIGNEE FROM \"MINNESOTA 55403\" TO \"NEW JERSEY 07962\" PREVIOUSLY RECORDED ON REEL 015456 FRAME 0672. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR(S) INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

CURTIS, HARLAN L.

Exec Dt:

11/15/2004