Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/06/2007
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Application #:
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11248183
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Filing Dt:
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10/13/2005
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Publication #:
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Pub Dt:
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05/25/2006
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Inventors:
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Hitoshi Sakurai, Kimihiro Abe, Norio Matsumoto
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Title:
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METHOD FOR REMOVING RESIN MASK LAYER AND METHOD FOR MANUFACTURING SOLDER BUMPED SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 671-4, MIZUASHI, NOGUCHI-CHO, KAKOGAWA-SHI |
| HYOGO 675-0019, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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