Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10543097
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Filing Dt:
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07/22/2005
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Publication #:
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Pub Dt:
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06/01/2006
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Inventors:
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Keiichi Kurashina, Keisuke Namiki, Tsutomu Nakada, Koji Mishima
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Title:
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Plating device and planting method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, HANEDA, ASAHI-CHO, OHTA-KU |
| TOKYO 144-8510, JAPAN |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| ATTN: NILS E. PEDERSEN, ESQ. |
| 2033 K STREET, N.W., SUITE 800 |
| WASHINGTON, DC 20006-1021 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, HANEDA ASAHI-CHO, OHTA-KU, |
| TOKYO, JAPAN |
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| WENDEROTH, LIND & PONACK, L.L.P. |
| 1030 15TH STREET, N.W. |
| SUITE 400 EAST |
| WASHINGTON, DC 20005 |
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