Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/09/2009
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Application #:
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10538306
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Filing Dt:
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06/09/2005
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Publication #:
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Pub Dt:
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06/01/2006
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Inventors:
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Makoto Ueki, Masayuki Hiroi, Nobuyuki Ikarashi, Yoshihiro Hayashi
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Title:
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COPPER ALLOY FOR WIRING, SEMICONDUCTOR DEVICE, METHOD FOR FORMING WIRING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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