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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/14/2008
Application #:
11289785
Filing Dt:
11/30/2005
Publication #:
Pub Dt:
06/08/2006
Inventors:
Junichi Nakamura, Tetsuo Sakaguchi, Kazuya Mukoyama, Sachiko Oda, Masahiro Yumoto
Title:
METHOD OF MANUFACTURING A CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING AN ELECTRONIC PARTS PACKAGING STRUCTURE
Assignment: 1
Reel/Frame:
017149/0028Recorded: 02/09/2006Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/01/2005
Exec Dt:
12/01/2005
Exec Dt:
12/01/2005
Exec Dt:
12/01/2005
Exec Dt:
12/01/2005
Assignee:
80, OSHIMADA-MACHI,
NAGANO-SHI, NAGANO, JAPAN 381-2287
Correspondent:
ARMSTRONG, KRATZ, QUINTOS, HANSON & BROO
1725 K STREET, NW
SUITE 1000
WASHINGTON, DC 20006

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