Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11012760
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Filing Dt:
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12/15/2004
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Publication #:
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Pub Dt:
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06/15/2006
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Inventors:
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Hsien-Wei Chen, Hao-Yi Tsai, Shih-Hsun Hsu, Bai-Yao Lou
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Title:
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Semiconductor wafer with protection structure against damage during a die separation process
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6 |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| HOWARD CHEN |
| DUANE MORRIS LLP |
| ONE MARKET STREET |
| SPEAR TOWER, SUITE 2000 |
| SAN FRANCISCO, CA 94105-1104 |
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