Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11338551
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Filing Dt:
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01/24/2006
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Publication #:
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Pub Dt:
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06/15/2006
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Inventors:
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Hsuch-Chung Chen, Yi-Lung Cheng, Hsien-Wei Chen, Shin-Puu Jeng
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Title:
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Heat dissipation structure and method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSRIAL PARK |
| HSIN-CHU, TAIWAN 300-77, R.O.C. |
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| DANIEL R. MCCLURE |
| THOMAS, KAYDEN, HORSTEMEYER & ET AL |
| 100 GALLERIA PARKWAY |
| SUITE 1750 |
| ATLANTA, GEORGIA 30339 |
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