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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/27/2007
Application #:
11008359
Filing Dt:
12/09/2004
Publication #:
Pub Dt:
06/15/2006
Inventors:
Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth JR., Madhusudan K. Iyengar et al
Title:
COOLING APPARATUS AND METHOD FOR AN ELECTRONICS MODULE EMPLOYING AN INTEGRATED HEAT EXCHANGE ASSEMBLY
Assignment: 1
Reel/Frame:
015523/0150Recorded: 01/04/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/11/2004
Exec Dt:
11/11/2004
Exec Dt:
11/11/2004
Exec Dt:
11/11/2004
Exec Dt:
11/11/2004
Exec Dt:
11/11/2004
Assignee:
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
HESLIN ROTHENBERG FARLEY & MESITI, P.C.
KEVIN P. RADIGAN, ESQ.
5 COLUMBIA CIRCLE
ALBANY, NEW YORK 12203

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