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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
7329617
Issue Dt:
02/12/2008
Application #:
11019421
Filing Dt:
12/22/2004
Publication #:
20060131720
Pub Dt:
06/22/2006
Inventors:
Jianxiong Li, Chi Chuen Chaw, Ngai Kin Tsui, Deming Liu, Yiu Fai Kwan, Wai Chan
Title:
COATING FOR ENHANCING ADHESION OF MOLDING COMPOUND TO SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
016279/0099Recorded: 02/16/2005Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
LI, JIANXIONG
Exec Dt:
12/20/2004
CHAW, CHI CHUEN
Exec Dt:
12/24/2004
TSUI, NGAI KIN
Exec Dt:
12/29/2004
LIU, DEMING
Exec Dt:
01/05/2005
KWAN, YUI FAI
Exec Dt:
01/18/2005
CHAN, WAI
Exec Dt:
01/19/2005
Assignee:
ASM ASSEMBLY AUTOMATION LTD.
20/F., WATSON CENTRE
61-22 KUNG YIP STREET
KWAI CHUNG, SWITZERLAND SAR
Correspondent:
OSTROLENK, FABER, GERB & SOFFEN, LLP
1180 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10036-8403
Assignment: 2
Reel/Frame:
016813/0598Recorded: 11/03/2005Pages: 3
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE DOCUMENT DATES AND THE RECEIVING PARTY ADDRESS, PREVIOUSLY RECORDED AT REEL 016279, FRAME 0099.
Assignors:
LI, JIANXIONG
Exec Dt:
01/19/2005
CHAW, CHI CHUEN
Exec Dt:
12/24/2004
TSUI, NGAI KIN
Exec Dt:
12/29/2004
LIU, DEMING
Exec Dt:
12/20/2004
KWAN, YIU FAI
Exec Dt:
01/05/2005
CHAN, WAI
Exec Dt:
01/18/2005
Assignee:
ASM ASSEMBLY AUTOMATION LTD.
20/F., WATSON CENTRE
16-22 KUNG YIP STREET
KWAI CHUNG, HONG KONG, CHINA SAR
Correspondent:
OSTROLENK, FABER, GERB & SOFFEN, LLP
1180 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10036-8403
Assignment: 3
Reel/Frame:
056309/0274Recorded: 05/21/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
ASM ASSEMBLY AUTOMATION LIMITED
Exec Dt:
12/01/2020
Assignee:
ADVANCED ASSEMBLY MATERIALS INTERNATIONAL LIMITED
UNIT B1, PORTION B, 1/F, GATEWAY TS, 8 CHEUNG FAI ROAD
TSING YI, NT, HONG KONG
Correspondent:
CPA GLOBAL LIMITED
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JEI IBL JERSEY

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