Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/07/2006
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Application #:
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11333316
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Filing Dt:
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01/18/2006
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Publication #:
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Pub Dt:
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06/22/2006
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Inventors:
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Masahiro Nakano, Katsuhiko Gunji, Katsuo Sato, Yasunobu Oikawa
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Title:
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PACKAGING SUBSTRATE AND MANUFACTURING METHOD THEREOF, INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF, AND SAW DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-13-1, NIHONBASHI, CHUO-KU |
| TOKYO, JAPAN 103-8272 |
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| MCGINN I.P. LAW GROUP, PLLC |
| 8321 OLD COURTHOUSE ROAD, SUITE 200 |
| VIENNA, VA 22182-3817 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121 |
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| QUALCOMM INCORPORATED |
| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CA 92121 |
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